| 1. Standard Polyimide Film Tape |
Silicone |
Approximately −73°C to 260°C, depending on construction |
25–75 μm film; 50–110 μm total tape |
High dielectric strength; typically suitable for turn-to-turn and component isolation |
Insulating cell tabs, busbars, welded joints, and pack wiring |
Excellent heat resistance, thin profile, good conformability, and clean removal |
Silicone residue and adhesion must be checked when the tape is used near sensitive surfaces |
| 2. High-Adhesion Polyimide Tape |
High-tack silicone |
Approximately −40°C to 200–260°C |
50–100 μm film; 80–140 μm total tape |
Electrical insulation comparable to the underlying polyimide film |
Securing insulation over curved cells, corners, and vibration-prone pack areas |
Better holding power on metal, coated foils, and slightly textured surfaces |
Higher adhesion can make repositioning difficult and may increase peel force during service |
| 3. Low-Outgassing Polyimide Tape |
Low-outgassing silicone or acrylic |
Approximately −40°C to 180–260°C |
25–50 μm film; 50–90 μm total tape |
Stable dielectric insulation when applied to clean, dry surfaces |
Sealed battery modules, precision electronics, and enclosed pack compartments |
Reduced volatile emissions and lower contamination risk in enclosed assemblies |
Requires confirmation of outgassing data, adhesive compatibility, and aging performance |
| 4. Flame-Retardant Polyimide Tape |
Flame-retardant silicone or modified acrylic |
Approximately −40°C to 180–260°C |
50–100 μm film; 80–150 μm total tape |
Provides dielectric separation; flame rating depends on the complete tape construction |
Barrier layers around busbars, terminals, interconnects, and module partitions |
Adds an extra layer of material-level fire-resistance support |
Tape alone cannot prevent thermal runaway; verify the required flammability classification |
| 5. Antistatic Polyimide Tape |
Static-dissipative silicone or acrylic system |
Approximately −40°C to 150–200°C |
25–75 μm film; 50–115 μm total tape |
Controlled surface resistance helps reduce electrostatic charge accumulation |
Cell manufacturing, inspection, testing, and handling of electrostatic-sensitive parts |
Combines high-temperature film insulation with static-control properties |
It is not a substitute for grounding, ESD flooring, wrist straps, or controlled work procedures |
| 6. Corona- and Arc-Resistant Polyimide Tape |
Specialized silicone |
Approximately −40°C to 200–260°C |
50–125 μm film; 80–175 μm total tape |
Designed for demanding dielectric environments; actual voltage rating depends on thickness and geometry |
High-voltage battery modules, busbar edges, and areas with concentrated electric fields |
Improved resistance to electrical discharge and insulation stress |
Sharp edges, contamination, air gaps, and excessive voltage can still cause insulation failure |
| 7. Printable or Color-Coded Polyimide Tape |
Silicone or acrylic |
Approximately −40°C to 180–260°C |
25–75 μm film; 50–120 μm total tape |
Provides the dielectric properties of the selected polyimide construction |
Polarity marking, inspection identification, cable routing, and maintenance labeling |
Improves traceability without adding a separate label layer |
Ink adhesion, abrasion resistance, and print durability must be validated after heat and electrolyte exposure |